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The 08-3518-10M is CONN IC DIP SOCKET 8POS GOLD, that includes 518 Series, they are designed to operate with a DIP, 0.3" (7.62mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, Mounting Type is designed to work in Through Hole, as well as the Open Frame Features, the device can also be used as Polyamide (PA46), Nylon 4/6, Glass Filled Housing Material. In addition, the Number of Positions or Pins Grid is 8 (2 x 4), the device is offered in 0.100" (2.54mm) Pitch Mating, the device has a Gold of Contact Finish Mating, and Pitch Post is 0.100" (2.54mm), and the Contact Finish Post is Tin, and Contact Finish Thickness Mating is 10μin (0.25μm), and the Contact Material Mating is Beryllium Copper, and Contact Finish Thickness Post is 200μin (5.08μm), and the Contact Material Post is Brass.
The 08-3518-10T is CONN IC DIP SOCKET 8POS GOLD, that includes DIP, 0.3" (7.62mm) Row Spacing Type, they are designed to operate with a Solder Termination, Series is shown on datasheet note for use in a 518, that offers Pitch Post features such as 0.100" (2.54mm), Pitch Mating is designed to work in 0.100" (2.54mm), as well as the Bulk Packaging, the device can also be used as 8 (2 x 4) Number of Positions or Pins Grid. In addition, the Mounting Type is Through Hole, the device is offered in Polyamide (PA46), Nylon 4/6, Glass Filled Housing Material, the device has a Open Frame of Features, and Contact Material Post is Brass, and the Contact Material Mating is Beryllium Copper, and Contact Finish Thickness Post is 200μin (5.08μm), and the Contact Finish Thickness Mating is 10μin (0.25μm), and Contact Finish Post is Tin, and the Contact Finish Mating is Gold.
The 08-3518-11 is CONN IC DIP SOCKET 8POS GOLD, that includes Gold Contact Finish Mating, they are designed to operate with a Gold Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 10μin (0.25μm), that offers Contact Finish Thickness Post features such as 10μin (0.25μm), Contact Material Mating is designed to work in Beryllium Copper, as well as the Brass Contact Material Post, the device can also be used as Open Frame Features. In addition, the Housing Material is Polyamide (PA46), Nylon 4/6, Glass Filled, the device is offered in Through Hole Mounting Type, the device has a 8 (2 x 4) of Number of Positions or Pins Grid, and Packaging is Bulk, and the Pitch Mating is 0.100" (2.54mm), and Pitch Post is 0.100" (2.54mm), and the Series is 518, and Termination is Solder, and the Type is DIP, 0.3" (7.62mm) Row Spacing.
The 08-3518-11H is CONN IC DIP SOCKET 8POS GOLD, that includes Through Hole Mounting Type, they are designed to operate with a Solder Termination, Housing Material is shown on datasheet note for use in a Polyamide (PA46), Nylon 4/6, Glass Filled, that offers Features features such as Open Frame, Contact Finish Mating is designed to work in Gold, as well as the Gold Contact Finish Post, the device can also be used as DIP, 0.3" (7.62mm) Row Spacing Type. In addition, the Packaging is Bulk, the device is offered in Brass Contact Material Post, the device has a Beryllium Copper of Contact Material Mating, and Number of Positions or Pins Grid is 8 (2 x 4), and the Series is 518, and Contact Finish Thickness Mating is 10μin (0.25μm), and the Contact Finish Thickness Post is 10μin (0.25μm), and Pitch Mating is 0.100" (2.54mm), and the Pitch Post is 0.100" (2.54mm).
