9icnet provides you with BDN18-6CB/A01 designed and produced by CTS Thermal Management Products, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. BDN18-6CB/A01 price reference $5.36000. CTS Thermal Management Products BDN18-6CB/A01 Package/Specification: HEATSINK CPU W/ADHESIVE 1.81"SQ. You can download BDN18-6CB/A01 english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
Prices and stocks marked on 9icnet are for reference only. If you don't find what you are looking for, you can contact us by email or online message, such as BDN18-6CB/A01 price, stock quantity, data sheet and manufacturer. We look forward to your contact and provide you with quality service.
The BDN17-3CB/A01 is HEATSINK CPU W/ADHESIVE 1.71"SQ, that includes Black Color, they are designed to operate with a Aluminum Material, Series is shown on datasheet note for use in a BDN, that offers Product features such as Heat Sinks, Type is designed to work in Top Mount, as well as the Adhesive Mounting Style, the device can also be used as 9.02 mm Height. In addition, the Length is 1.710" (43.43mm), the device is offered in 1.710" (43.43mm) Width, the device has a Square, Pin Fins of Shape, and Package Cooled is Assorted (BGA, LGA, CPU, ASIC...), and the Attachment Method is Thermal Tape, Adhesive (Included), and Height Off Base Height of Fin is 0.355" (9.02mm), and the Thermal Resistance Forced Air Flow is 3.8°C/W @ 400 LFM, and Thermal Resistance Natural is 11.5°C/W, and the Material Finish is Black Anodized, and Designed for is BGA PGA PLCC QFP, and the Heatsink Material is Aluminum, and Thermal Resistance is 11.5 C/W.
The BDN18-3CB/A01 is HEATSINK CPU W/ADHESIVE 1.81"SQ, that includes 1.810" (45.97mm) Width, they are designed to operate with a Top Mount Type, Thermal Resistance Natural is shown on datasheet note for use in a 10.8°C/W, that offers Thermal Resistance Forced Air Flow features such as 3.5°C/W @ 400 LFM, Shape is designed to work in Square, Pin Fins, as well as the BDN Series, the device can also be used as Assorted (BGA, LGA, CPU, ASIC...) Package Cooled. In addition, the Material Finish is Black Anodized, the device is offered in Aluminum Material, the device has a 1.81" (45.97mm) of Length, and Height Off Base Height of Fin is 0.355" (9.02mm), and the Attachment Method is Thermal Tape, Adhesive (Included).
The BDN183CBA01 is Heat Sinks IERC Heat Sink 1.81x1.81x0.355 manufactured by Tusonix / CTS. is part of the Thermal - Heat Sinks, , and with support for Heat Sinks IERC Heat Sink 1.81x1.81x0.355.
