久芯网

XC7S15-1CSGA225C

  • 描述:电源电压: 0.95伏~1.05伏 供应商设备包装: 225-CSPBGA(13x13) 工作温度: 0摄氏度~85摄氏度(TJ) 安装类别: 表面安装
  • 品牌: AMD塞琳思 (AMD Xilinx)
  • 交期:5-7 工作日
渠道:
  • 自营
  • 得捷
  • 贸泽

起订量: 1

  • 库存: 580
  • 单价: ¥162.99576
  • 数量:
    - +
  • 总计: ¥163.00
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规格参数

  • 部件状态 可供货
  • 闸门数量 -
  • 安装类别 表面安装
  • 工作温度 0摄氏度~85摄氏度(TJ)
  • 制造厂商 AMD塞琳思 (AMD Xilinx)
  • 逻辑阵列块/可配置逻辑块数量 one thousand
  • 逻辑元件/单元的数量 12800
  • 电源电压 0.95伏~1.05伏
  • RAM 总位数 368640
  • 输入/输出数量 100
  • 包装/外壳 225-LFBGA,CSPBGA
  • 供应商设备包装 225-CSPBGA(13x13)

XC7S15-1CSGA225C 产品详情

Xilinx® 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications.

Feature

• Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
• Quickly deploy embedded processing with MicroBlaze™ processor.
• Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
• Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
• Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
XC7S15-1CSGA225C所属分类:现场可编程门阵列(FPGA),XC7S15-1CSGA225C 由 AMD塞琳思 (AMD Xilinx) 设计生产,可通过久芯网进行购买。XC7S15-1CSGA225C价格参考¥162.995756,你可以下载 XC7S15-1CSGA225C中文资料、PDF数据手册、Datasheet数据手册功能说明书,可查询XC7S15-1CSGA225C规格参数、现货库存、封装信息等信息!
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