The 5916-9103-603 parts manufactured by RADIALL are available for purchase at 9icnet Electronics. Here you can find various types and values of electronic parts from the world's leading manufacturers. The 5916-9103-603 components of 9icnet Electronics are carefully chosen, undergo stringent quality control, and are successfully meet all required standards.
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The 5-916783-2 is CONN SOCKET PGA ZIF 370POS GOLD, that includes PGA, ZIF (ZIP) Type, they are designed to operate with a Tray Packaging, Termination is shown on datasheet note for use in a Solder, that offers Mounting Type features such as Through Hole, Features is designed to work in Open Frame, as well as the Liquid Crystal Polymer (LCP) Housing Material, the device can also be used as 370 (19 x 19) Number of Positions or Pins Grid. In addition, the Pitch Mating is 0.100" (2.54mm), the device is offered in Gold Contact Finish Mating, the device has a 0.100" (2.54mm) of Pitch Post, and Contact Finish Post is Gold, and the Contact Finish Thickness Mating is 30μin (0.76μm), and Contact Material Mating is Phosphor Bronze, and the Contact Finish Thickness Post is 30μin (0.76μm), and Contact Material Post is Phosphor Bronze.
The 5916657-3 is CONN SOCKET PGA ZIF 321POS GOLD, that includes PGA, ZIF (ZIP) Type, they are designed to operate with a Solder Termination, Pitch Post is shown on datasheet note for use in a 0.100" (2.54mm), that offers Pitch Mating features such as 0.100" (2.54mm), Packaging is designed to work in Tray, as well as the 321 (19 x 19) Number of Positions or Pins Grid, the device can also be used as Through Hole Mounting Type. In addition, the Housing Material is Thermoplastic, the device is offered in Open Frame Features, the device has a Copper Alloy of Contact Material Post, and Contact Material Mating is Copper Alloy, and the Contact Finish Thickness Post is 30μin (0.76μm), and Contact Finish Thickness Mating is 30μin (0.76μm), and the Contact Finish Post is Gold, and Contact Finish Mating is Gold.
5916716-1 with circuit diagram, that includes Gold Contact Finish Mating, they are designed to operate with a Gold Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 30μin (0.76μm), that offers Contact Finish Thickness Post features such as 30μin (0.76μm), Contact Material Mating is designed to work in Copper Alloy, as well as the Copper Alloy Contact Material Post, the device can also be used as Open Frame Features. In addition, the Housing Material is Thermoplastic, the device is offered in Through Hole Mounting Type, the device has a 321 (19 x 19) of Number of Positions or Pins Grid, and Packaging is Tray, and the Pitch Mating is 0.100" (2.54mm), and Pitch Post is 0.100" (2.54mm), and the Termination is Solder, and Type is PGA, ZIF (ZIP).
