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MXD2020EL

  • 描述:种类: 数字的 加速度阈值: ±1g 电源电压: 3V~5.25V 频段宽度: 17赫兹 供应商设备包装: 8-LCC 工作温度: -40摄氏度~105摄氏度(TA)
  • 品牌: 美新半导体 (Memsic)
  • 交期:5-7 工作日
渠道:
  • 自营
  • 得捷
  • 贸泽

起订量: 2500

数量 单价 合计
2500+ 54.06155 135153.87750
  • 库存: 0
  • 单价: ¥54.06155
  • 数量:
    - +
  • 总计: ¥135,153.88
在线询价

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规格参数

  • 部件状态 可供货
  • 种类 数字的
  • 灵敏度(mV/g) -
  • 安装类别 表面安装
  • 灵敏度(LSB/g) -
  • 特点 -
  • 轴线 X, Y
  • 工作温度 -40摄氏度~105摄氏度(TA)
  • 制造厂商 美新半导体 (Memsic)
  • 频段宽度 17赫兹
  • 电源电压 3V~5.25V
  • 包装/外壳 8-LCC
  • 加速度阈值 ±1g
  • 供应商设备包装 8-LCC
  • 输出类别 PWM

MXD2020EL 产品详情

The MXD2020EL is a non-temperature compensated high-performance XY Thermal Accelerometer with very low 0g offset drift versus temperature. It is very repeatable and immune from mechanical shocks changing its operating characteristics making it ideal for demanding applications where a user temperature calibration will be applied on a per device basis to achieve the performance needed for the most demanding applications. In addition to the acceleration outputs, the MXD2020EL also provides a very repeatable analogue temperature output which can be used for the over-temperature calibration. Thermal MEMS sensing technology provides unsurpassed vibration immunity with an inherent low-pass frequency response of 17Hz eliminating errors attributable to out-of-band and not-of-interest higher frequency accelerations. It is built monolithically using a standard 0.6um CMOS process.

Feature

  • Fully integrated
  • 7mV/C Analogue temperature output
  • 0g Temperature drift of 0.4mg/C
  • Inherent 17Hz low pass filter response (vibration immunity)
  • Operating temperature range from -40 to 105°C
  • Shock survival is greater than 50,000g
  • Acceleration outputs are analogue

Applications

Automotive, Security, Computers & Computer Peripherals, RF Communications
MXD2020EL所属分类:加速度计,MXD2020EL 由 美新半导体 (Memsic) 设计生产,可通过久芯网进行购买。MXD2020EL价格参考¥54.061551,你可以下载 MXD2020EL中文资料、PDF数据手册、Datasheet数据手册功能说明书,可查询MXD2020EL规格参数、现货库存、封装信息等信息!

美新半导体 (Memsic)

美新半导体 (Memsic)

采用MEMS集成电路和MEMIC集成电路设计的制造商。MEMSIC将专有的基于热的MEMS技术和先进的模拟混合信号处理电路结合到一个芯片中。这使得MEMSIC能够以比大多数传统工艺低得多的成本生产高性能...

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