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S29GL01GS11TFV023 with pin details, that includes GL-S Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 56-TFSOP (0.724", 18.40mm Width), it has an Operating Temperature range of -40°C ~ 105°C (TA), Interface is designed to work in Parallel, as well as the 2.7 V ~ 3.6 V Voltage Supply, the device can also be used as 56-TSOP Supplier Device Package. In addition, the Memory Size is 1G (64M x 16), the device is offered in FLASH - NOR Memory Type, the device has a 110ns of Speed, and Format Memory is FLASH.
S29GL01GS11WEI019 with user guide, that includes 2.7 V ~ 3.6 V Voltage Supply, they are designed to operate with a Wafer Supplier Device Package, Speed is shown on datasheet note for use in a 110ns, that offers Series features such as GL-S, Packaging is designed to work in Bulk, as well as the Die Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA). In addition, the Memory Type is FLASH - NOR, the device is offered in 1G (64M x 16) Memory Size, the device has a Parallel of Interface, and Format Memory is FLASH.
S29GL01GS11WEI029 with circuit diagram, that includes FLASH Format Memory, they are designed to operate with a Parallel Interface, Memory Size is shown on datasheet note for use in a 1G (64M x 16), that offers Memory Type features such as FLASH - NOR, it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the Die Package Case, the device can also be used as Bulk Packaging. In addition, the Series is GL-S, the device is offered in 110ns Speed, the device has a Wafer of Supplier Device Package, and Voltage Supply is 2.7 V ~ 3.6 V.