9icnet provides you with SG-8018CE 164.571429M-TJHSA0 designed and produced by EPSON, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. SG-8018CE 164.571429M-TJHSA0 price reference $0.64350. EPSON SG-8018CE 164.571429M-TJHSA0 Package/Specification: XTAL OSC XO 164.571429MHZ CMOS S. You can download SG-8018CE 164.571429M-TJHSA0 english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
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714-43-161-31-018000 with pin details, that includes 714 Series, they are designed to operate with a SIP Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 125°C, as well as the Through Hole Mounting Type, the device can also be used as Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Housing Material. In addition, the Number of Positions or Pins Grid is 61 (1 x 61), the device is offered in 0.100" (2.54mm) Pitch Mating, the device has a Gold of Contact Finish Mating, and Pitch Post is 0.100" (2.54mm), and the Contact Finish Post is Gold, and Contact Finish Thickness Mating is 30μin (0.76μm), and the Contact Material Mating is Beryllium Copper, and Contact Finish Thickness Post is 30μin (0.76μm), and the Contact Material Post is Brass Alloy.
714-43-162-31-018000 with user guide, that includes SIP Type, they are designed to operate with a Solder Termination, Series is shown on datasheet note for use in a 714, that offers Pitch Post features such as 0.100" (2.54mm), Pitch Mating is designed to work in 0.100" (2.54mm), as well as the Bulk Packaging, it has an Operating Temperature range of -55°C ~ 125°C. In addition, the Number of Positions or Pins Grid is 62 (1 x 62), the device is offered in Through Hole Mounting Type, the device has a Polycyclohexylenedimethylene Terephthalate (PCT), Polyester of Housing Material, and Contact Material Post is Brass Alloy, and the Contact Material Mating is Beryllium Copper, and Contact Finish Thickness Post is 30μin (0.76μm), and the Contact Finish Thickness Mating is 30μin (0.76μm), and Contact Finish Post is Gold, and the Contact Finish Mating is Gold.
714-43-163-31-018000 with circuit diagram, that includes Gold Contact Finish Mating, they are designed to operate with a Gold Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 30μin (0.76μm), that offers Contact Finish Thickness Post features such as 30μin (0.76μm), Contact Material Mating is designed to work in Beryllium Copper, as well as the Brass Alloy Contact Material Post, the device can also be used as Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Housing Material. In addition, the Mounting Type is Through Hole, the device is offered in 63 (1 x 63) Number of Positions or Pins Grid, it has an Operating Temperature range of -55°C ~ 125°C, and Packaging is Bulk, and the Pitch Mating is 0.100" (2.54mm), and Pitch Post is 0.100" (2.54mm), and the Series is 714, and Termination is Solder, and the Type is SIP.