9icnet provides you with SG-8018CE 4.1000M-TJHSA0 designed and produced by EPSON, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. SG-8018CE 4.1000M-TJHSA0 price reference $0.64350. EPSON SG-8018CE 4.1000M-TJHSA0 Package/Specification: XTAL OSC XO 4.1000MHZ CMOS SMD. You can download SG-8018CE 4.1000M-TJHSA0 english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
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1000170001 with pin details, that includes Black Color, they are designed to operate with a Omnimate BL Series, Type is shown on datasheet note for use in a Plug, Female Sockets, that offers Packaging features such as Bulk, Termination Style is designed to work in Screwless - Leg Spring, Push-In Spring, it has an Operating Temperature range of -50°C ~ 100°C, the device can also be used as Free Hanging (In-Line) Mounting Type. In addition, the Features is Retention Latches (Wire Side), the device is offered in 16 Number of Positions, the device has a 0.200" (5.08mm) of Pitch, and Wire Gauge or Range AWG is 12-26 AWG, and the Wire Gauge or Range mm2 is 0.2-2.5mm2, and Current IEC is 24A, and the Voltage IEC is 400V, and Current UL is 18.5A, and the Voltage UL is 300V, and Number of Levels is 1, and the Positions Per Level is 16, and Plug Wire Entry is 90°, and the Contact Mating Finish is Tin.
The 100-016-051 is CONN IC DIP SOCKET 16POS GOLD, that includes DIP, 0.3" (7.62mm) Row Spacing Type, they are designed to operate with a Solder Termination, Series is shown on datasheet note for use in a 100, that offers Pitch Post features such as 0.100" (2.54mm), Pitch Mating is designed to work in 0.100" (2.54mm), as well as the Bulk Packaging, it has an Operating Temperature range of -65°C ~ 125°C. In addition, the Number of Positions or Pins Grid is 16 (2 x 8), the device is offered in Through Hole Mounting Type, the device has a Polyphenylene Sulfide (PPS), Glass Filled of Housing Material, and Features is Closed Frame, Seal Tape, and the Contact Material Post is Brass, and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is Flash, and Contact Finish Thickness Mating is 8μin (0.20μm), and the Contact Finish Post is Gold, and Contact Finish Mating is Gold.
100018 (502) with circuit diagram manufactured by EXAR. The 100018 (502) is available in QFP Package, is part of the IC Chips.
